Electroplating gold alloys and electrolytes therefor
AssigneeOxy Metal Industries Corporation
InventorsJohn Alan Crossley, Valerie Kathryn Hacker nee Weimer, Paul Grahame Clorley
Life of this patent
Estimating the term…
Abstract
Disclosed is an electrolyte for the deposition of predominantly gold alloy deposits, a method for the preparation and use of the electrolyte, and an article obtained by such electrodeposition. These electrolytes contain soluble gold and base metal salts, a buffer system effective at pH 4-6, and either a soluble aluminum compound or formate or oxalate ions. Preferably, the electrolyte contains both the aluminum and formate or oxalate ions.
Claims14
An aqueous electrolyte solution for use in the electrodeposition of gold which comprises gold in the form of a soluble salt at a concentration of 1 to 32 grams per liter of gold, a base metal selected from the group consisting of cobalt and nickel in the form of a soluble salt at a concentration of 0.1 to 20 grams per liter of base metal, a compatible buffer system effective to produce a pH of 4 to 6 and a density of 1.degree. to 32.degree. Baume, aluminium in the form of a soluble salt at a concentration of 0.01 to 2 grams per liter, and formate or oxalate ions at a concentration of 1 to 250 grams per liter.
Dependencies are inferred from the claim text.