Liquid lamination process
AssigneeE. I. Du Pont de Nemours and Company
InventorMichael Glenn Fickes
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Abstract
The process of this invention applies a photoresist film to a preimaged patterned relief substrate wherein the height of the relief image is at least 0.00004 inch (0.001 mm) and the thickness of the photoresist film is at least one third the thickness of the relief image height. Prior to the application of the photoresist film, the patterned relief substrate is flooded with a swelling agent for the photoresist, the depth of flooding being at least to cover the relief height. The process can occur at room temperature.
Claims9
In a process for applying a photoresist film to a preimaged, patterned relief substrate wherein the height of the relied image is at least 0.0004 inch and the thickness of the photoresist film is at least one third the thickness of the relief image height, the improvement comprising flooding with a solvent or non-solvent swelling agent the patterned relief substrate to a depth of swelling agent at least to cover the relief height prior to the application of said photoresist film.
Dependencies are inferred from the claim text.