Method for cracking brittle material
AssigneeRCA Corporation
InventorsNicholas Francis Gubitose, Leonard Gawelko, Robert Joseph Satriano
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Abstract
A machine for separating a sheet of brittle material, for example a semiconductor wafer, into a plurality of pellets is disclosed. The pellets are defined by a plurality of intersecting scribed lines on the sheet. The machine includes a member for applying a shear force to an edge of the sheet whereby the maximum bending moment is applied at a preselected scribe line. The machine is particularly applicable for use with those semiconductor wafers which have a solder coating on both sides.
Claims4
A method of cracking a sheet of brittle material having two intersecting sets of parallel scribe lines, said sets enclosing a plurality of pellets thereon comprising the steps of:
- supporting said sheet in a cantilever manner at a point at least one scribe line away from an edge thereof, said edge being substantially parallel with said scribe lines;
- applying, by means of a shear blade, a shear force to said edge of said sheet, whereby said sheet is fractured at said one scribe line;
- repeating said method until all scribe lines of one set are fractured, whereby a plurality of rows of pellets are formed;
- and
- rotating said rows of pellets and repeating said method on the other set of parallel scribe lines.
Dependencies are inferred from the claim text.