Method for electroplating
OwnerFelix R. Rapidsinventor
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Abstract
An improved method and composition for plating a workpiece with tin, cadmium, lead, or indium which involves first applying an aqueous electrolyte to the substrate with a rubbing action and without electroplating voltage being applied and then applying the electroplating voltage to an anode composed of one of the aforementioned metals, utilizing the same aqueous electrolyte to plate metal from the anode onto the substrate. The aqueous electrolyte contains dissolved free sulfamic acid in concentrations up to saturation, and the electrolyte is substantially devoid of ions of a plateable metal. The electrolyte preferably includes a small amount of a surface active wetting agent.
Claims4
The method of plating a metal selected from the group consisting of tin, cadmium, lead, and indium onto a substrate which comprises providing an anode of said selected metal encased in a liquid absorbent sleeve, dipping said sleeve into an aqueous electrolyte containing dissolved free sulfamic acid in a concentration up to saturation and a non-ionic surface active agent to impregnate said sleeve with said electrolyte, said electrolyte being substantially devoid of ions of a plateable metal, rubbing the impregnated sleeve onto said substrate without electroplating voltage being applied, and thereafter applying an electroplating voltage to said anode to cause deposition of said metal onto said substrate.
Dependencies are inferred from the claim text.