Method for sawing hard material
OwnerGiorgio Benetelloinventor
Life of this patent
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Abstract
A method for sawing hard material with circular abrasive disc saws of the kind having secured to the periphery of the disc arcuated cutting segments of bonded diamond abrasives, in which conventional speed of rotation of the abrasive disc, cutting depth of the disc and longitudinal feed are selected for abrasive disc. On the arcuated cutting segments of bonded diamond abrasives an effective total peripheral cutting surface consisting of the sum of the cutting surfaces of the single arcuated segments is provided having along a peripheral circumference an optimum average number of cutting points of the bonded diamond abrasive per one millimeter width as determined as a function of the ratio of the selected longitudinal feed and the product of an average incision depth made by a single diamond point.
Claims3
A method for sawing hard material with circular abrasive disc saws of the kind having secured to the periphery of the disc arcuated cutting segments of bonded diamond abrasives, comprising the steps of:
- selecting a speed of rotation of the abrasive disc;
- selecting a cutting depth of the disc;
- selecting a longitudinal feed for said abrasive disc;
- providing on said arcuated cutting segments of bonded diamond abrasives an effective total peripheral cutting surface consisting of the sum of the cutting surfaces of the single arcuated segments and having along a peripheral circumference an optimum average number of cutting points of the bonded diamond abrasive per one millimeter width as determined by the following formula:
- z = (a/a.sub.z .multidot. n)
- where:
- z is the said optimum average number of cutting points of the bonded diamond abrasive per one millimeter width along the peripheral circumference,
- a is said selected longitudinal feed expressed in microns per minute,
- n is said selected speed of rotation of the abrasive disc expressed in rounds per minute,
- a.sub.z is a preestablished parameter indicating the average specific optimum incision depth expressed in microns and cut into the material to be cut by one single average cutting point of the bonded diamond abrasive during n revolutions of the disc and with said selected longitudinal feed thereof,
- and wherein said preestablished parameter of average specific optimum incision depth is in the range of from about 2.5 to about 3.5,
- and cutting the hard material with said so provided optimum number of cutting points and with said selected longitudinal feed and said selected speed of rotation of the abrasive disc and with said selected cutting depth.
Dependencies are inferred from the claim text.