Method of bonding gold films to non-electrically conducting oxides and product thereby obtained
AssigneeThe United States of America as represented by the Secretary of the Navy
InventorsWallace E. Anderson, Albert M. Syeles, Albert D. Krall
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Abstract
A microstrip board comprising a gold film which contains about at least 1/2 weight per cent of aluminum bonded to a non-electrical conducting oxide is prepared by simultaneously evaporating the gold and aluminum onto the non-electrical conducting oxide and thereafter optionally heating the film thus formed.
Claims3
A microstrip board comprising a gold film which contains at least one-half weight percent of aluminum, bonded to a non-electrical conducting oxide of alumina.
A microstrip board comprising a gold film which contains one-half to five weight percent of aluminum, bonded to a non-electrical conducting oxide of alumina.
A microstrip board comprising a gold film which contains about two weight percent of aluminum, bonded to a non-electrical conducting oxide of alumina.
Dependencies are inferred from the claim text.