Marking metal

A method of marking metal surfaces comprising positioning a metal surface at a marking position, moving stencils for indexing the stencils over the metal surface at the marking position to locate the desired marking indicia in the marking position, supporting a liquid metal spray member on a support member and moving the support member with the liquid metal spray member through the stencils transversely of the direction of movement in indexing the stencils over the metal surface at the marking position over the stencil surface in the marking position and spraying liquid metal from the spray member through the stencil onto the metal surface, mounting a release compound spray member and a cleaning member on the support member for the liquid metal spray member for moving the release compound spray member and cleaning member with the liquid metal spray member transversely of the direction of movement in indexing the stencil, and applying a release coating of a release compound from the release compound spray member on the stencil surface before the liquid metal spray step and cleaning the stencil surface with the cleaning member after the liquid metal spray step for removing from the stencil surface any metal deposited thereon by moving the support across the stencil surface.

Apparatus for marking metal surfaces, comprising stencil means, means for moving said stencil means over the metal surface to be marked, means for spraying a liquid metal through the stencil means for marking the metal surface, means for applying a release compound onto the surface of the stencil means through which the liquid metal is sprayed for depositing a release coating for aiding in the removal of the sprayed liquid metal deposited on the surface of the stencil means, cleaning means for removing sprayed metal from the surface of said stencil means, support means, means for moving the support means through said stencil means and transversely of the direction of movement of said stencil means, said support means supporting said liquid metal spray means, said release compound applying means and said cleaning means so that the release compound is applied to the stencil means before liquid metal is sprayed through the stencil means and sprayed metal is removed from the stencil means after liquid metal is sprayed through the stencil means.

Apparatus for marking metal comprising a plurality of stencil rings, means for movably indexing the stencil rings to a marking position, a carriage, means for reciprocally moving the carriage past the marking position through the stencil rings and in a direction transverse to the direction of movably indexing the stencil rings, a spray gun for liquid metal mounted on the carriage for spraying liquid metal through said stencil rings in the marking position onto the metal to be marked, means mounted on said carriage for applying a release compound to the surface of the stencil rings through which the liquid metal is applied for depositing a release coating thereon at the marking position prior to the spraying of the liquid metal, and means mounted on such carriage for removing sprayed metal adhered to the surface of the stencil means after the liquid metal spraying, said means for applying the release compound comprises a spray nozzle and said means for removing sprayed metal comprises a brush, so that the application of the release compound, the spraying of the liquid metal and the brushing of the stencil surface can be effected in the reciprocal movement of said carriage.