Metal deposition process
AssigneeImperial Chemical Industries PLC
InventorTimothy Douglas Andrews
Life of this patent
Estimating the term…
Abstract
Metal is deposited on a substrate containing neutral radicals, radical cations or neutral molecules (the latter being derived from a dication normally stable in aqueous media), by contacting the substrate with an electroless plating solution, optionally after sensitization with a salt of a platinum group metal silver or gold. The use of the process for data recording, particularly for the production of magnetic information carriers e.g. tapes or discs, metallizing plastic foam and for producing printed circuits is described.
Claims19
A process for the deposition of metal in or on substrate characterized in that the substrate contains or consists of, as active component, a polymeric compound comprising units derived from a cation of the general formula ##STR14## where R.sup.1-12 are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution.
A data recording process which comprises preparing a substrate, containing or consisting of, as active component, a polymeric compound comprising units derived from a cation of the general formula ##STR16## where R.sup.1-12 are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution, exposing said substrate to radiation or heat, and subsequently contacting with an electroless plating solution.
A method of producing metallised foam which includes the steps of introducing an active polymeric compound comprising units derived from a cation of the general formula ##STR18## wherein R.sup.1-12 ae hydrogen, halogen, or organic substituents and n = 0 or an integer into a plastics foam and electroless plating, consolidating the deposited metal by electroplating and optionally removing the plastics material.
A method of producing printed circuits for electrical or electronic devices in which a circuitwise distribution of a polymer compound comprising of units of an active component derived from a cation of the general formula ##STR20## where R.sup.1-12 are hydrogen, halogen or organic substituents and n=0 or an integer is formed on a base support material, electroless plating, and building up the metallic layer by further plating.
Dependencies are inferred from the claim text.