Electrodeposition of palladium
AssigneeOxy Metal Industries Corporation
InventorsPeter Stevens, John M. Deuber
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Abstract
Disclosed is a palladium electroplating bath and a method of plating therewith. The bath contains palladium as the palladosammine chloride and a phosphonic compound which is an alkylene diamine phosphonate derivative. The bath may be employed to plate palladium or its alloys. In a preferred embodiment, a pure palladium deposit may be obtained which exhibits very low porosity even after subsequent cold forming of the article on which it is deposited.
Claims12
A stable aqueous electroplating bath useful for the electrodeposition of palladium or palladium base alloys comprising palladosammine chloride in an amount of 0.1 to 50 g/l palladium, sulfonic acid in an amount of about 1.0 to 100 g/l, and at least 5 g/l of a phosphonic compound of the formula:
- ##STR3## wherein R is an alkylene group of 2 - 6 carbon atoms, each R' is an alkylene group of 1 to 4 carbon atoms, and each M is a non-deleterious cationic moiety,
- said bath exhibiting a pH value of from 7.0-10.0.
An aqueous electroplating bath for the electrodeposition of palladium, comprising:
- ______________________________________ Component Concentration ______________________________________ Ethylene diamine tetra- (methylphosphonic acid) 5 g/l to solubility limit Pd(NH.sub.3).sub.2 Cl.sub.2 0.1 to 50 g/l Sulfamic acid 1 to 100 g/l Ammonium chloride 1 to 200 g/l Ammonium monohydrogen phosphate 1 to 100 g/l Ammonium hydroxide to pH 4.5 to 12. ______________________________________
Dependencies are inferred from the claim text.