Multi-point microprobe for testing integrated circuits

In a multiple contact lead structure for use with a semiconductor device having a substantially planar surface with a plurality of closely spaced contact pads on said surface forming a pattern adjacent the outer perimeter of the same, the multiple contact lead structure comprising a flexible sheet-like member of insulating material having one portion thereof forming a substantially planar surface and a plurality of spaced leads of thin metallic film adjacent to said surface of said sheet-like member so that they are insulated from each other and having inner and outer extremities with the inner extremities being generally tapered and substantially narrower than the outer extremities, the inner extremities forming a pattern of contact areas lying generally in a single plane which conform to the pattern of the contact pads and are adapted to make contact therewith.

In combination, a semiconductor device having a substantially planar surface area, a plurality of relatively closely spaced contact pads provided on said surface area and forming a pattern of contact pads exclusively adjacent the outer perimeter of the device, a flexible sheet-like connector member of an insulating material having one portion thereof forming a substantially planar surface and a plurality of spaced leads of thin metallic film adherent to and being supported by said surface of said sheet-like member with said leads being insulated from each other and having inner and outer extremities, the inner extremities of the leads being substantially narrower than the outer extremities, the inner extremities of the leads forming a pattern of contact areas which conform to the pattern of the contact pads, said semiconductor device and said flexible sheet-like member being positioned adjacent each other and with the contact areas and the contact pads in electrical contact with each other.

In an assembly, a semiconductor device having a substantially planar surface area, a plurality of relatively closely spaced contact pads provided on said surface area and forming a pattern of contact pads exclusively adjacent the outer perimeter of the device, a flexible sheet-like member of an insulating material having one portion thereof forming a substantially planar surface and a plurality of spaced leads of thin metallic film adherent to and being supported by said surface of said sheet-like member with said leads being insulated from each other and having inner and outer extremities, the inner extremities of the leads being substantially narrower than the outer extremities, the inner extremities of the leads forming a pattern of contact areas which conform to the pattern of the contact pads, said semiconductor device and said flexible sheet-like member being positioned adjacent each other and with the contact areas and the contact pads in at least temporary electrical contact with each other.

In a multiple contact lead structure for use with a semiconductor device having a substantially planar surface with a plurality of closely spaced contact pads on said surface forming a pattern adjacent the outer perimeter of the same, a flexible sheet-like member of insulating material having one portion thereof forming a substantially planar surface and a plurality of spaced leads of thin metallic film adjacent to said surface of said sheet-like member so that they are insulated from each other and having inner and outer extremities with the inner extremities being generally tapered and substantially narrower than the outer extremities, the inner extremities forming a pattern of contact areas lying generally in a single plane which conform to the pattern of the contact pads and are adapted to at least make temporary contact therewith.

In combination, a semiconductor device having a substantially planar surface area, a pluraity of relatively closely spaced contact pads provided on said surface area and forming a pattern of contact pads exclusively adjacent the outer perimeter of the device, a flexible sheet-like connector member of an insulating material having one portion thereof forming a substantially planar surface and a plurality of spaced leads of thin metallic film adherent to and being supported by said surface of said sheet-like member with said leads being insulated from each other and having inner and outer extremities, the inner extremities of the leads being substantially narrower than the outer extremities, the inner extremities of the leads forming a pattern of contact areas which conform to the pattern of the contact pads, the semiconductor device and said flexible sheet-like member being positioned adjacent each other and with the contact areas and the contact pads in at least temporary electrical contact with each other.