Hermetic enclosure for electronic component

An enclosure comprising

• a silver container open at one end, said container having a tubular wall portion and a unitary outwardly protruding flange at said open end, said unitary outwardly protruding flange having a U-shaped cross-section and having two substantially parallel walls which are in a plane substantially perpendicular to said wall portion,
• an electrical component having a metallic lead extending from one end thereof, said component being disposed within said container,
• a glass bead sealed to said lead along its length intermediate the ends thereof, and
• a metallic collar having a temperature coefficient of expansion greater than said glass bead fitted about said glass bead so as to place said glass bead in compression thereby effecting a compression seal between said collar and said glass bead, said metallic collar having a unitary outwardly protruding flange in a plane substantially perpendicular to said collar and disposed between and in contact with said two walls of said unitary outwardly protruding flange of said container, said unitary outwardly protruding flange of said collar being hermetically sealed to the unitary outwardly protruding flange of said container.