Polyimide adhesives
AssigneeThe United States of America as represented by the United States National Aeronautics and Space Administration
InventorsDonald J. Progar, Vernon L. Bell, Terry L. St. Clair
Life of this patent
Estimating the term…
Abstract
A process of preparing aromatic polyamide-acids for use as adhesives by reacting an aromatic dianhydride to an approximately equimolar amount of an aromatic diamine in a water or lower alkanol miscible ether solvent and wherein the polyamide-acids are converted to polyimides by heating to the temperature range of 200.degree. - 300.degree. C. and wherein the polyimides are thermally stable and insoluble in ethers and other organic solvents.
Claims6
A method for preparing an adhesive solution comprising:
- reacting an aromatic dianhydride with an approximately equimolar quantity of an aromatic diamine,
- the reactants being previously dissolved in a liquid selected from the group consisting of 1,2-dimethoxyethane, bis(2-methoxyethyl)ether, 1,2,bis(2-methoxyethoxy)ethane and bis-[2-(2-methoxyethoxy) ethyl]ether.
Dependencies are inferred from the claim text.