Negative-resistance semiconductor device

A negative-resistance semiconductor device comprising:

• a semiconductor substrate of a specified conductivity type,
• a diffused defined region having the conductivity type opposite to that of said semiconductor substrate,
• a first pair of highly doped electrode regions made in said defined region and having the conductivity type same with that of the defined region,
• a second pair of highly doped electrode regions made in said defined region and having the conductivity type opposite to that of the defined region,
• said second pair of electrode regions being situated with a specified space inbetween, the space having a surface inversion region at the surface of said inbetween part on the defined region, thereby constituting a first field-effect transistor of inversion channel type with drain, source and gate,
• said electrode regions of the first pair being situated with another specified space inbetween having one of said electrode region of the second pair inbetween, thereby constituting a second field-effect transistor of junction gate type with drain, source and gate,
• a first lead-out conductor connected in ohmic relation to said one electrode region of second pair for leading out the drain of the first field-effect transistor and the junction gate of the second field-effect transistor,
• a second lead-out conductor connected in ohmic relation to said the other electrode region of the second pair for leading out the drain of the second field-effect transistor and a back-gate to the inversion channel of the first field-effect transistor.

A negative-resistance semiconductor device comprising a semiconductor substrate (6) of p-type conductivity,

• an epitaxial growth region (7) of n-type conductivity formed on one face of said substrate (6),
• a defined region (9) of a p-type conductivity formed by diffusion in the epitaxial growth region (7), and defined by a p-n junction from the epitaxial growth region (7),
• a first junction-gate type field-effect transistor (F1) of n-channel type to be operated in a depletion mode, and made in said epitaxial growth region (7),
• a second junction-gate type field-effect transistor (F2) of p-channel type to be operated in a depletion mode, made in said defined region (9), the first and the second field-effect transistors being complementary to each other, and
• the source electrode (11) of a first field-effect transistor (F1) being connected to the source electrode (14) of a second field-effect transistor (F2) by partly superposing their regions,
• the drain electrode (10) of the first FET (F1) being connected to the gate (12) of the second FET (F2),
• the drain electrode (13) of the second FET (F2) being connected to the gate (8) of the first FET (F1).

A negative-resistance semiconductor device comprising:

• a semiconductor substrate region (7) of a specified conductivity type,
• a pair of defined regions (9, 17), having the conductivity type opposite to that of said substrate region (7), and defined by p-n junctions from the substrate region (7),
• a first field-effect transistor (F1) of a surface inversion channel type to be operated in a depletion mode, formed in one (17) of said defined regions, and having a channel region (21) consisting of a surface inversion layer and gate, (22), source (19) and drain (18) electrodes,
• a second field-effect transistor (F2) of junction gate type to be operated in a depletion mode, formed in the other one (9) of the defined regions and having gate (12), drain (13) and source (14) electrodes, the lower part of said defined region (9) constituting the p-type channel,
• the first and the second field-effect transistors being in complementary relation to each other, and
• the source electrode (19) of the first field-effect transistors being connected to the source electrode (14) of the second field-effect transistors by overlapping extended parts of said two source electrodes (19, 14) each other extending on the substrate region (7),
• the drain of the first field-effect transistor (F1) being connected to the gate of the second one,
• the drain of a second field-effect transistor (F2) being connected to the gate of the first one.

A negative-resistance semiconductor device comprising:

• a semiconductor substrate (7) of n-type conductivity,
• a diffused defined region (25) having p-type conductivity,
• a first pair of highly doped p+-type electrode regions (26 and 27) formed in said defined region (25),
• a second pair of highly doped n+-type electrode regions (28, 29) formed in said defined region (25),
• said second pair of electrode regions (28, 29) being situated with a specified space inbetween, the space having a n-type surface inversion region (21) at the surface of said inbetween, part on the defined region (25), thereby constituting a first field-effect transistor (F1) of n-type inversion channel type with drain (28), source (29) and gate (25),
• said electrode regions (26, 27) of the first pair being situated with another specified space inbetween having one of said electrode region (28) of the second pair inbetween, thereby constituting a second field-effect transistor F2 of junction gate type with drain (26), source (27) and gate (28),
• the source (27) of said second field-effect transistor (F2) being connected to the source (29) of said first field-effect transistor (F1),
• a first lead-out conductor (15) connected in ohmic relation to said drain (28) of the first field-effect transistor (F1) also serving as the gate (28) of the second field-effect transistor (F2),
• a second lead-out conductor (16) connected in ohmic relation to the drain (26) of the second field-effect transistor (F2) also serving as the gate (25) of the type of a back-gate to the inversion channel (21) of the first field-effect transistor (F1).