Anode structure for wire and strip line electroplating
AssigneeM&T Chemicals Inc.
InventorsFrederick Walter Eppensteiner, R. E. Woehrle
Life of this patent
Estimating the term…
Abstract
Methods and apparatus are provided for high speed wire and/or strip line electroplating of metals such as tin and zinc on a metal substrate by utilizing in the anode assembly therefor a combination of the plating metal as the anode and an anode support comprised essentially of a member selected from the group consisting of tantalum, niobium, and mixtures thereof.
Claims6
An anode structure for use in wire and strip line electroplating which comprises an anode of the metal to be electroplated selected from the group consisting of tin, zinc, and tin-zinc alloys;
- a support for said anode and disposed adjacent thereto, said support comprised essentially of at least one member selected from the group consisting of tantalum, niobium and mixtures thereof;
- and a sub-support disposed adjacent said support on the side thereof opposite said anode, said sub-support being comprised of the metal to be electroplated.
An anode structure for use in wire and strip line electroplating which comprises an anode of the metal to be electroplated selected from the group consisting of tin, zinc, and tin-zinc alloys;
- a support for said anode and disposed adjacent thereto, with at least the surface of said support comprised essentially of a member selected from the group consisting of tantalum, niobium and mixtures thereof;
- and a sub-support disposed adjacent said support on the side thereof opposite said anode, said sub-support being comprised of the metal to be electroplated.
Dependencies are inferred from the claim text.