Connector for leadless integrated circuit packages

A connector for removably mounting a leadless circuit package of planar configuration on a backpanel and electrically coupling the terminal pads of the leadless circuit package to the backpanel, said connector comprising:

• a. a housing for mounting on the backpanel, said housing having endless upstanding side walls which form the perimeter of an upwardly opening chamber into which the leadless circuit package is nestingly positionable with a planar surface thereof disposed to extend above the side walls of said housing;
• b. electrical interconnecting means mounted in said housing and extending into the chamber thereof for engaging the terminal pads of the leadless circuit package when that package is positioned therein, said electrical interconnecting means extending from said housing for engaging the backpanel when said housing is mounted thereon;
• c. a plurality of stud means mounted on said housing in substantially evenly spaced increments so as to be upstanding from each of the side walls thereof in an array which surrounds the cavity of said housing;
• and
• d. a cover positionable above said housing in overlaying relationship with respect to the side walls thereof and in contiguous engagement with the extending planar surface of the leadless circuit package when that package is positioned in the chamber of said housing, said cover being laterally and downwardly movable relative to said housing for exerting a downwardly directed force on the leadless circuit package when that package is positioned in the chamber of said housing, said cover having a plurality of apertured inclined plane means formed therein for receiving said stud means when said cover is positioned above said housing and which move into engagement with said stud means upon lateral movement of said cover to cause downward deflection thereof.