Thermoplastic reinforcing adhesives and substrates coated therewith

An improved copolyamide resin composition useful as a hot-melt reinforcing adhesive for flexible materials which comprises the condensation product of essentially stoichiometric amounts of (a) a mixture of a polymeric fatty acid, obtained from the polymerization of an olefinically unsaturated monocarboxylic acid containing from 16 to 20 carbon atoms, and a saturated aliphatic dicarboxylic acid having from 7 to 12 carbon atoms, the equivalent ratio of the respective acid components ranging from about 0.95:0.05 to about 0.7:0.3, with (b) a mixture of a saturated aliphatic diamine having from 2 to 6 carbon atoms and a polyoxyalkylene diamine of the formula ##STR2## where R is hydrogen or a methyl group and m is a positive integer so that the average molecular weight of the polyoxyalkylene diamine is between 600 and 5000, the equivalent ratio of said aliphatic diamine to said polyoxyalkylene diamine ranging from about 0.92:0.08 to 0.995:0.005.