Gold and gold alloy deposition
AssigneeOxy Metal Industries Corporation
InventorsAndre R. Meyer, Salvatore Losi, Erwin Marka, Jacques Rudio, Franco Zuntini
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Abstract
Disclosed is a bath and process for obtaining deposits of gold or gold alloys of improved uniformity of deposit thickness on an irregularly shaped conductive surface. The aqueous plating bath contains gold as the aurocyanide complex, a mild reducing agent, a complexing agent, arsenic as a water-soluble arsenic compound, and a substituted polyamine.
Claims4
An aldehyde-free aqueous bath having a pH of from about 5 to 10 for the electrodeposition of gold and its alloys containing gold as the aurocyanide complex, a mild reducing agent selected from the groups consisting of hydrazine, hydroxylamine, piperazine, guanidine, and the organic substituted derivatives thereof, a complexing agent selected from the group consisting of N-methylcarboxylated and N-methylphosphonylated amines, from 1 to 20 mg/l arsenic as a water-soluble arsenic compound, and from 1 to 100 mg/l of a substituted polyamine of formula
- R.sub.2 N(R--NR).sub.m --R'--NR.sub.2
- at least one R group is an aliphatic or aromatic radical having 1 to 6 carbon atoms or hydroxy derivative thereof, and the remaining R groups, if any, are hydrogen;
- R' is an alkylene radical of 1 to 5 carbon atoms or a hydroxy derivative thereof and m is equal to 0, 1 or 2, the polyamine being present in an amount such that the weight ratio of polyamine/AS is between 1 and 5/1.
Dependencies are inferred from the claim text.