Method of patching voids in a semi-conductive component of insulated electric cable, and compound therefor

A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of a blend containing ethylene-propylene rubber and at least about 65% by weight of the polymeric contents of chlorosulfonated polyethylene, conductive filler material, and lauroyl peroxide in an amount of about 2 to about 8 parts by weight per 100 parts by weight of the blend of ethylene-propylene rubber and chlorosulfonated polyethylene, and heating the curable semiconductive polymeric composition to a temperature of at least about 200.degree. F.

A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound comprising at least about 75% to about 100% by weight of the polymeric material of chlorosulfonated polyethylene and 0 to about 25% by weight of the polymeric material of ethylene-propylene rubber, conductive carbon black filler, and about 2 to about 8 parts by weight of lauroyl peroxide per 100 parts by weight of said polymeric material, and heating the curable semiconductive polymeric compound to a temperature of at least about 200.degree. F for a period of at least about 20 minutes.

A method of patching voids in a body of semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound comprising about 75 to 100 parts by weight of chlorosulfonated polyethylene, 0 to about 25 parts by weight of ethylene-propylene rubber, about 15 to about 100 parts by weight of conductive carbon black filler, and a curing agent consisting essentially of about 2 to about 8 parts by weight of lauroyl peroxide, and heating the curable semiconductive polymeric compound to a temperature of at least about 200.degree. F for a period of at least about 30 minutes.

A method of patching voids in a body of a semiconductive component of an insulated electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of about 75 to 100 parts by weight of chlorosulfonated polyethylene 0 to about 25 parts by weight of ethylene-propylene rubber, about 15 to about 100 parts by weight of conductive filler, about 0.5 to about 5 parts by weight of a curing coagent, and about 2 to about 8 parts by weight of lauroyl peroxide and heating the curable semiconductive polymeric compound to a temperature of at least about 200.degree. F up to about 250.degree. F for a period of at least about 20 minutes.

A method of patching voids in a body of a semiconductive compound of an insulating electrical cable, comprising the steps of filling a void in a semiconductive body with a curable semiconductive polymeric compound consisting essentially of about 75 to 100 parts by weight chlorosulfonated polyethylene, 0 to about 25 parts by weight of ethylene-propylene rubber, about 50 to about 100 parts by weight of conductive carbon black, about 2 to about 8 parts by weight of lauroyl peroxide, about 0.5 to about 5 parts by weight of a curing coagent, hydrocarbon oil, litharge, hydrocarbon wax, and antioxidant, and heating the curable semiconductive polymeric compound to a temperature of at least about 200.degree. F up to about 250.degree. F for a period of about 30 to about 60 minutes.