Method of bonding a dielectric substrate to a metallic carrier in a printed circuit assembly

A method of bonding a first body of a given material to a second body of a material different than said given material comprising the steps of:

• forming a plurality of vent means in a given surface of one of said first and second bodies;
• tinning said given surface and one surface of the other of said first and second bodies separately with solder, said one surface to be bonded to said given surface;
• cleaning said tinned given surface and said tinned one surface separately to clean both of said tinned surfaces;
• applying a flux to both of said cleaned tinned surfaces separately;
• placing both of said fluxed cleaned tinned surfaces in contact with each other;
• applying heat and pressure simultaneously to both of said first and second bodies until said solder of both of said fluxed cleaned tinned surfaces flows;
• and
• cooling both of said bodies in a natural manner to room temperature while still applying said pressure to bond said first body to said second body;
• said plurality of vent means removing excess flux and solder during said step of applying heat and pressure to provide an intimate bonded contact between both of said surfaces and to prevent said solder from flowing onto undesirable areas.