Support for photosensitive resin

A process for producing a support for photosensitive resin for use in making a printing plate using a liquid photosensitive resin, said process comprising the steps of applying, onto a flexible self-support base plate, and adhesive composition consisting of (A), (B) and (C) as shown below:

• A. a compound which is a linear polycondensation product formed between epichlorohydrin and polyhydric phenolic compound, the polycondensation product having a molecular weight of up to 4,000 and containing 1,2-epoxy groups at both terminals or a diepoxyester compound selected from the group consisting of diglycidyl-2,6-naphthalenedicarboxylate, diglycidyl-2,7-naphthalenedicarboxylate, diglycidyl o-phthalate, diglycidyl isophthalate, diglycidyl terephthalate, diglycidyl methylisophthalate, and diglycidyl methylterephthalate;
• B. a compound selected from one of the group comprising
• i. a compound containing an effectively photopolymerizable unsaturated carbon-to-carbon double bond moiety having the formula ##STR7## wherein R is hydrogen or an alkyl, and a 1,2-epoxy group in the molecule and having a boiling point of at least 120.degree. C., or
• ii. a reaction product of the component (B) (i) with an amine curing agent selected from the group consisting of aliphatic amines, aromatic amines, and amino-terminated polyamide resin obtained by the condensation of an aliphatic dicarboxylic acid with ethylene diamine and having a degree of polymerization of 5 to 20, the reaction product containing an effectively photopolymerizable unsaturated carbon-to-carbon double bond moiety having the formula ##STR8## wherein R is hydrogen or an alkyl, and an amino group in the molecule and having a boiling point of at least 120.degree. C.;
• and
• C. an organic curing agent for epoxy resins containing at least two active hydrogen atoms but not containing an effectively photopolymerizable carbon-to-carbon double bond, or an organic compound convertible to said curing agent during the reaction, and selected from the group consisting of:
• aliphatic amines, aromatic amines, polycarboxylic acids, acid anhydrides, phenol resins, urea resins, polyester resins, polysulfide resins, melamine resins, and polyamide resins;
• and
• then heating the adhesive composition to a temperature from 50.degree. C. to 180.degree. C. so as to thereby cure it three-dimensionally on the flexible self-supporting base plate in a fashion such that an adhesive layer containing 1 .times. 10.sup.-4 to 1 .times. 10.sup.-2 mol/gr. of an effectively photopolymerizable unsaturated carbon-to-carbon double bond is formed on the flexible self-supporting base plate.