A method of manufacturing a polyoxymethylene filament comprising thermally treating polyoxymethylene having a molecular weight of from 30,000 to 100,000 and containing stabilizing additives comprising an antioxidant and an acceptor of formaldehyde in a quantity of from 0.1 to 3.0% of the weight of said polyoxymethylene at a temperature of from 100.degree. to 150.degree. C and at a residual pressure of from 1 to 100 mm. Hg to constant weight, melting said thermally treated polyoxymethylene at a temperature of from 170.degree. to 230.degree. C, forcing the melt through the orifices of an extrusion nozzle, cooling the jets of said melt leaving the orifices of the extrusion nozzle to a temperature of from 70.degree. to 169.degree. C in a cooling medium selected from the group consisting of air, an inert gas and steam, drawing the moulded filament obtained after said cooling at a temperature of from 120.degree. to 165.degree. C to a length exceeding the initial length by about from 7 to 14 times to obtain a polyoxymethylene filament having a tensile strength of from 70 to 100 grams per tex, an elongation at rupture of about from 9% to 12%, and an initial modulus of about from 1200 to 1800 kilograms per square millimeter, and thermally treating the drawn filament, while maintaining it under tension, at a temperature of from 2.degree. to 50.degree. C above the temperature at which the filament was drawn to produce a polyoxymethylene filament having a shrinkage rate of from 0 to 5% at 150.degree. C.