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US 4,059,437 AGranted
Oxygen-free copper product and process
AssigneePhelps Dodge Industries, Inc.
InventorsDonald John Nesslage, Lin Sheng Yu, Michael Francis Shaw
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AssigneePhelps Dodge Industries, Inc.
InventorsDonald John Nesslage, Lin Sheng Yu, Michael Francis Shaw
Estimating the term…
An improved copper product and process of making it, wherein oxygen-free copper contains small amounts of manganese above normal impurity levels, and has enhanced grain size control during annealing, high electrical conductivity, and increased ductility as cast or fabricated. By adding approximately 1 to approximately 100 parts per million of manganese, the desired oxygen-free product has a minimum electrical conductivity of 100% I.A.C.S. By adding approximately 1 to approximately 50 parts per million of manganese, the desired oxygen-free product has a minimum electrical conductivity of 101% I.A.C.S. When at least approximately 30 parts per million of manganese are added to the oxygen-free copper, ductility is maximized. The manganese may be added at any convenient stage of producing the oxygen-free copper. The copper after annealing is free of or less subject to roughened surfaces or cracking.
An improved oxygen-free copper product consisting essentially of non-deoxidized oxygen-free copper containing normal impurities and manganese in addition from approximately 1 to approximately 100 parts per million by weight, further characterized by having a minimum electrical conductivity of at least 100% I.A.C.S.
A process of providing an improved oxygen-free copper, wherein the copper is processed to be free from oxygen by conventional non-deoxidizing means, and manganese is added during the processing in an amount from approximately 1 to approximately 100 parts per million by weight.
An improved oxygen-free copper product consisting essentially of non-deoxidized oxygen-free copper containing normal impurities and manganese in addition from approximately 1 to approximately 100 parts per million by weight, further characterized by having been annealed, having a minimum electrical conductivity of at least 100% I.A.C.S., and having a controlled grain structure of relatively homogeneous grain sizes.
A process of controlling grain size during annealing in oxygen-free copper to obtain relatively homogeneous grain sizes, wherein the copper is processed to be free from oxygen by conventional non-deoxidizing means, manganese is added in an amount from approximately 1 to approximately 100 parts per million by weight, and the copper is annealed.
Dependencies are inferred from the claim text.