Deckle cooling means to prevent leakage
AssigneeMitsubishi Petrochemical Co., Ltd.
InventorsTakao Yazaki, Kazuhide Hattori
Life of this patent
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Abstract
In a process for melting, extruding, and forming a thermoplastic synthetic resin, wherein a deckle mounted on a die device of an extruder is moved lengthwise of a slit in the die to thereby vary the length of the slit and to adjust the width of a flat film being extruded, the improvement comprising stopping the leaking of the molten resin around the deckle portion by forcibly cooling the deckle with a cooling medium, such as air, water or the like, so as to increase the viscosity of the molten resin around the deckle, whereby a decreased fluidity of the molten resin occurs.
Claims2
In a die structure having manifold means within the die structure for receiving molten resin, an outlet slit through which a thin film of molten resin may be extruded and deckle means for controlling the width of the resin film being extruded from said slit the improvement comprising said deckle means being comprised of a cylindrical portion having cooling passages therein disposed in said manifold means in contact with the portions of said die structure defining the entrance to said slit from said manifold and fin means integrally connected to said cylindrical portion and extending into said slit.
Dependencies are inferred from the claim text.