Packaging of semiconductor discs
AssigneeWacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
InventorsGunther Lechner, Karl Pritscher, Helmut Kirschner
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Abstract
A stackable plastics pallet for packaging semiconductor discs on a gas-ti foil covering, said pallet having a plurality of circular depressions each for accommodating a semiconductor disc, and means for securing the discs between the pallets, the securing means being in the form of sloping part-sector shaped surfaces surrounding said depressions, with two opposite sets of sloping surfaces clamping the semiconductor discs at their outermost rims and immobilizing them thereby.
Claims5
A stackable plastic pallet assembly for packing semiconductor discs in a vertically-disposed stack of substantially identical pallets, comprising:
- at least one stackable plastic pallet having a plurality of circular depressions, each of which may accommodate a semiconductor disc and means for releasably securing the discs in said depressions, said means comprising a plurality of part sector-shaped surfaces which surround and slope downwardly toward the center of said depressions on which the outermost rims of the discs may rest and a plurality of part sector-shaped surfaces which surround and slope upwardly toward the center of said depressions and which, upon stacking of said at least one pallet in a vertically-disposed stack of substantially identical pallets, cooperate with the downwardly sloping part sector-shaped surfaces of the pallet therebelow to clamp the outermost rims of the discs contained in the depressions of the lowermost pallet therebetween, thereby immobilizing the discs.
Dependencies are inferred from the claim text.