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US 4,056,681 AGranted
Self-aligning package for integrated circuits
AssigneeInternational Telephone and Telegraph Corporation
InventorCharles R. Cook, Jr.
Life of this patent
Estimating the term…
Abstract
A self-aligning integrated circuit package includes an integrated circuit die having raised contact pads mounted to an interconnecting die in flip chip fashion. The interconnecting die is formed of anodizable material and has raised anodized portions that form guide means for aligning the integrated circuit die and the leads of a lead frame so that they are positioned over conductive portions of the interconnecting die which connect the contact pads of the integrated circuit to the leads of the lead frame.
Claims69
An interconnecting die for use in integrated circuit packaging for connecting contact means of an integrated circuit die with contact means of an integrated circuit package, said interconnecting die comprising:
- a substrate of anodizable electrically conductive material including unanodized conducting regions and anodized non-conducting regions;
- first contact means associated with said substrate to contact the contact means of the integrated circuit die when placed in juxtapostion and properly aligned with the integrated circuit die;
- and
- second contact means associated with said substrate to contact the contact means of the integrated circuit package when placed in juxtaposition and properly aligned therewith, said conducting regions of the substrate being formed and arranged for electrically connecting said first and second contact means of the interconnecting die, whereby the contact means of the integrated circuit die and the contact means of the package may be connected using a single element with a minumum of bonding steps.
1 more element
A self-aligned integrated circuit device, comprising:
- an integrated circuit die having contact means formed thereon at predetermined locations;
- an interconnecting die formed of a substrate of an anodizable material and having a first set of contact means in juxtaposition with and bonded to the contact means of the integrated circuit die and a second set of contact means electrically connected to the first set of contact means by conducting regions of said substrate, said conducting regions being electrically isolated by non-conducting regions of said substrate;
- first guide means formed of anodized material on said interconnecting die for aligning the integrated circuit die on the interconnecting die;
- connecting means connected to the second set of contact means;
- and
- encapsulating means surrounding and sealing said integrated circuit die and interconnecting die, said connecting means being exposed for connection to external elements.
3 more elements
A self-aligning integrated circuit package for an integrated circuit die of the type that has contact means formed thereon at predetermined locations, said package comprising:
- an interconnecting die formed of a substrate of an anodizable material and having a first set of contact means formed and arranged to contact the contact means of the circuit die when placed in juxtaposition and properly aligned therewith and a second set of contact means electrically connected to the first set of contact means by conducting regions of said substrate, said conducting regions being electrically isolated by non-conducting regions of said substrate;
- guide means formed of anodized material on said interconnecting die for aligning the integrated circuit die on the interconnecting die;
- and
- connecting means connected to the second set of contact means for providing means to connect to external elements.
1 more element
A method of making an interconnecting die for an integrated circuit package, comprising the steps of:
- forming a protective dielectric layer on a surface of an anodizable substrate material;
- removing the dielectric in selected regions to expose the anodizable material;
- anodizing at least a portion of the anodizable material in the selected regions by submerging the anodizable material in an anodizing solution and applying an anodizing potential to the material so that the exposed material in the regions becomes an anode and forms a dielectric material;
- and
- continuing the anodizing until the dielectric material extends above the substrate surface thereby forming raised guide portions.
2 more elements
A method of making an interconnecting die for an integrated circuit package, comprising the steps of:
- masking selected conductive paths with a dielectric material on the surface of a substrate of a conductive and anodizable material;
- anodizing the material in the unmasked areas by submerging the material in an anodizing solution and applying an anodizing potential to the material so that the exposed material becomes an anode and is anodized to form a dielectric insulating material in the unmasked areas;
- and
- continuing said anodization until said anodized material extends above the surface of the masked conductive paths thereby forming raised guide portions.
1 more element
A method of packaging an integrated circuit die, comprising the steps of:
- forming an interconnecting die of an anodizable material having conductive portions connecting circuit die contact areas with connecting means contact areas;
- forming raised guide means on said interconnecting die by anodizing a portion of the anodizable material;
- placing a circuit die of the type having contact pads on said interconnecting die, said circuit die being guided in place by the raised guide means so that the contact pads on the circuit die engage the circuit die contact areas of the interconnecting die;
- bonding said engaged contact pads and areas;
- and
- hermetically sealing said circuit die and interconnecting die.
3 more elements
A method of making an interconnecting die of anodizable material for an integrated circuit package, comprising the steps of:
- anodizing at least a portion of the anodizable material in selected regions of a substrate of anodizable material to form a dielectric material;
- and
- continuing the anodization until the dielectric material extends above the substrate surface thereby forming raised guide portions.
An interconnecting die for use in integrated circuit packaging for connecting contact means of an integrated circuit die with contact means of an integrated circuit package, said interconnecting die comprising:
- a substrate;
- of anodizable material
- first contact means associated with said substrate to contact the contact means of the integrated circuit die when placed in juxtaposition and properly aligned with the integrated circuit die;
- second contact means associated with said substrate to contact the contact means of the integrated circuit package when placed in juxtaposition and properly aligned therewith;
- means for electrically connecting said first and second contact means;
- and
- guide means formed of anodized material on said substrate for guiding and aligning at least one of said circuit die and package contact means onto the substrate, whereby the contact means of the integrated circuit die and the contact means of the package may be aligned and connected using a single element with a minimum of bonding steps.
4 more elements
An interconnecting die for use in integrated circuit packaging for connecting contact means of an integrated circuit die with contact means of an integrated circuit package, said interconnecting die comprising:
- a substrate formed of anodizable material including conducting and non-conducting regions;
- first contact means associated with said substrate to contact the contact means of the integrated circuit die when placed in juxtaposition and properly aligned with the integrated circuit die;
- and
- second contact means including anodized material formed in said substrate and covered by a layer of aluminum to contact the contact means of the integrated circuit package when placed in juxtaposition and properly aligned therewith, said conducting regions of the substrate being formed and arranged for electrically connecting said first and second contact means of the interconnecting die, whereby the contact means of the integrated circuit die and the contact means of the package may be connected using a single element with a minimum of bonding steps.
1 more element
A method of packaging an integrated circuit die, comprising the steps of:
- forming an interconnecting die of anodizable material and having conductive portions connecting circuit die contact areas with connecting means contact areas;
- anodizing portions of said anodizable material to form raised guide means;
- placing a circuit die of the type having contact pads on said interconnecting die, said circuit die being guided in place by the raised guide means so that the contact pads on the circuit die engage the circuit die contact areas of the interconnecting die;
- and bonding said engaged contact pads and areas.
1 more element
A self-aligned integrated circuit device, comprising:
- an integrated circuit die having contact means formed thereon at predetermined locations;
- an interconnecting die formed of a substrate of silicon having a first set of contact means in juxtaposition with and bonded to the contact means of the integrated circuit die and a second set of contact means formed of anodized silicon covered by a layer of aluminum electrically connected to the first set of contact means by conducting regions of said substrate, said conducting regions being electrically isolated by non-conducting regions of said substrate;
- connecting means connected to the second set of contact means;
- and
- encapsulating means surrounding and sealing said integrated circuit die and interconnecting die, said connecting means being exposed for connection to external elements.
2 more elements
A self-aligned integrated circuit device, comprising:
- an integrated circuit die having contact means formed thereon at predetermined locations;
- an interconnecting die formed of a substrate of anodized aluminum having a first set of contact means in juxtaposition with and bonded to the contact means of the integrated circuit die and a second set of contact means electrically connected to the first set of contact means by conducting regions of non-anodized aluminum, said conducting regions being electrically isolated by the anodized regions of the substrate;
- connecting means connected to the second set of contact means;
- and
- encapsulating means surrounding and sealing said integrated circuit die and interconnecting die, said connecting means being exposed for connection to external elements.
2 more elements
An integrated circuit package for an integrated circuit die of the type that has contact means formed thereon at predetermined locations, said package comprising:
- a substrate of anodizable electrically conductive material including unanodized conducting regions and anodized non-conducting regions;
- first contact means associated with said substrate to contact the contact means of the integrated circuit die when placed in juxtaposition and properly aligned with the integrated circuit die;
- second contact means associated with said substrate and electrically connected to the first set of contact means by the unanodized conducting regions of the substrate, said conducting regions being electrically isolated by the non-conducting anodized regions of the substrate;
- and
- connecting means connected to the second set of contact means for providing means to connect to external elements.
2 more elements
Dependencies are inferred from the claim text.