Electrical connection structure and method
AssigneeInternational Business Machines Corporation
InventorsRoland Joseph Braun, William Ditlef VON Voss
Life of this patent
Estimating the term…
Abstract
Surface connections of electrical component leads to circuit substrate lands are made with split sleeves on the lead ends, adjusted for contact with the lands, and soldered in position to join leads, sleeves, and lands.
Claims8
In a circuit assembly, having a component with a plurality of interconnection pins adapted to be solder-connected to respective lands on a printed circuit card surface, the improvement comprising:
- a plurality of electrically conductive sleeve connectors, one for each pin of said component and adapted to be variably slideably mounted thereon according to the distance between said pin and said respective land with at least one of said pins being in direct contact with its said land, to thereby assure electrical contact between each of said pins and the respective land on the surface of said printed circuit card to which the pin is to be connected, said connectors being exclusively on the surface of said card.
In a circuit module having a plurality of interconnection pins contained therein, adapted to the solder-connected to respective lands on a printed circuit board surface, the improvement comprising:
- a plurality of electrically conductive sleeve connectors, one for each pin of said module, the inner surface of said connectors adapted to conform to the outer surface of said pins, each of said connectors having a slit in the vertical direction along the length of the connector, said connectors being adapted to be slideably mounted on respective pins according to the distance from said pin to said surface land of said module with at least one of said pins extending through the sleeve its said connector to thereby assure electrical contact between each of said pins and the respective land on the surface of the printed circuit board to which the pin is to be connected.
The method of joining a plurality of interconnection pins of a circuit module with respective surface lands of a circuit substrate comprising the steps of:
- placing on each of said pins a sleeve frictionally engaging said pin and extending beyond the unattached end of said pin;
- urging said module toward said substrate so that said sleeves engage said respective lands of said pins and slide axially along the pins until certain of said pins directly contact their said lands, and limit further motion, said sliding distances varying according to the distance of the pin ends from said lands;
- and
- soldering said sleeves to said lands and pins while said pins are aligned with said respective lands.
Dependencies are inferred from the claim text.