Beam lead testing apparatus
AssigneeRockwell International Corporation
InventorFrank A. Pizzarello
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AssigneeRockwell International Corporation
InventorFrank A. Pizzarello
Estimating the term…
An apparatus for testing the bond strength of beam leads is disclosed. The present invention involves testing apparatus that includes a movable table having a probe, a mounting bar adjacent said movable table having a base with an angled surface for mounting microcircuit devices having beam leads and a driving assembly that attaches to said mounting bar for rotating said mounting bar. The device chips are mounted on the mounting bar. The table is positioned towards and under the beam leads extending from the device, the probe on the index table is precisely adjusted to clamp the desired beam lead against the table. The driving assembly is activated to move the mounting bar away from the table until the beam lead is stripped therefrom. A force gage which is attached to the driving assembly measures the force required to strip the beam lead away from the device chip.
An apparatus for testing the strength of beam leads bonded to a device comprising:
An apparatus for testing the strength of beam leads bonded to a device comprising:
Dependencies are inferred from the claim text.