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US 4,055,725 AGranted
Circuit board assembly
AssigneeHollis Engineering, Inc.
InventorKenneth G. Boynton
Life of this patent
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AssigneeHollis Engineering, Inc.
InventorKenneth G. Boynton
Estimating the term…
Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120-195.degree. F. In a preferred embodiment of the invention compatible flux active agents and/or wetting agents may be intermixed with the liquid material whereby the board and component leads may be fluxed simultaneously with treating to temporarily stabilize the components in the board.
A method of treating electrical and electronic components assembled in a perforated circuit board in preparation for mass joining with solder said electrical and electronic components by their leads to said board, and wherein said component leads extend through at least some of the perforations in said board, said method comprising the steps in sequence of:
An article of manufacture comprising a circuit board having (a) a plurality of perforations, (b) a metallic pattern adjacent at least some of said perforations to which component leads can be mounted to said board by solder, (c) electrical and electronic components in position on said board with their leads extending through at least some of said perforations in said board and (d) a solid, solder-compatible meltable cement (1) at least partially covering at least some of said perforations and (2) intimately contacting (a) wall areas of said circuit board defining said perforations and (b) said leads extending through said perforations, said cement (i) having a melting point below that of said solder (ii) coupling said component leads and said board to one another.
Dependencies are inferred from the claim text.