Processes for the preparation of resinous bodies for adherent metallization comprising treatment with manganate/permanganate composition
AssigneeKollmorgen Technologies Corporation
InventorsEdward J. Leech, Joseph Polichette, John G. Branigan
Life of this patent
Estimating the term…
Abstract
Securely bonded layers of electroless metals on bodies having a resinous surface are provided after first contacting the surface of the body with a highly active, easily controllable, readily disposable composition comprising water, permanganate ion and manganate ion, the molar ratio of manganate to permanganate being up to about 1.2 and the composition having a pH controlled in the range of 11 to 13. Resinous surfaces so treated are neutralized in a process including treatment with hydrazine in order to yield metallized resinous surfaces exhibiting superior peel strengths following electroless metal deposition.
Claims11
In a process for producing a securely bonded layer of metal on a resinous surface by electroless metal deposition the improvement which comprises contacting the resinous surface, prior to electroless metal deposition, with a composition comprising water, permanganate ion and manganate ion in the molar ratio of manganate ion to permanganate ion of up to 1.2, said composition having a pH in the range of 11 to 13, followed by removal of substantially all oxidation by-products of said contacting from the resinous surface prior to electroless metal deposition.
In a process for producing a securely bonded layer of metal on a resinous surface by electroless metal deposition, the improvement which comprises contacting the resinous surface, prior to electroless metal deposition, with a composition comprising water, permanganate ion and manganate ion in the molar ratio of manganate ion to permanganate ion of up to 1.2, said composition having a pH of about 12.5, followed by contacting said resinous surface with a first neutralizing solution comprising water, a strong acid and a sequestering agent capable of forming soluble complexes with manganese ions, followed by contacting said resinous surface with a second neutralizing solution comprising water and hydrazine.
A process for producing a securely bonded layer of metal on a resinous surface by electroless metal of deposition comprising the stpes of:
- a. oxidizing the resinous surface with a composition comprising water, permanganate ion and manganate ion in the molar ratio of manganate ion to permanganate ion of up to 1.2, said composition having a PH of from about 11 to about 13;
- 1 b. neutralizing the oxidized resinous surface with a first solution comprising an acid complex reducing agent;
- c. further neutralizing the treated surface of step (b) with a second solution comprising hydrazine;
- and metallizing the surface in an electroless metal deposition bath.
Dependencies are inferred from the claim text.