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US 4,053,096 AGranted
Thermocompression welding device
AssigneeTexas Instruments Deutschland GmbH
InventorRichard Heim
Life of this patent
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AssigneeTexas Instruments Deutschland GmbH
InventorRichard Heim
Estimating the term…
A thermocompression welding device including a welding head having two tools for automatically and simultaneously effecting welds between a connecting wire and a pair of contact areas, one on a semiconductor chip and one on a housing for the chip. The weld head is transversed between consecutive weld positions using an X-Y table. The apparatus provides automatic adjustment of connecting wire length, and matched automatic adjustment of weld head separation, corresponding to different contact area spacings and automatic orientation of the welding head to correspond to different orientations of the pairs of contact areas. Preprogrammed lengths of wire are fed to the welding head from a continuous coil and bent into position for simultaneous engagement by both welding tools, the wire being severed adjacent one of the welds immediately following each welding operation.
Thermocompression welding apparatus for welding areas between a contact area of a semiconductor body and a corresponding contact area of a housing for said semiconductor body, including a welding capillary from the mouth of which the contacting wire emerges for application by said capillary to one of said contact areas to effect a weld between said one contact area and said connecting wire, the improvement comprising a separate welding tool laterally displaced from said welding capillary by a distance corresponding to the separation of said contact areas and means for moving said welding capillary and said welding tool through a path movement toward and away from said contact areas for applying said welding capillary and said welding tool simultaneously to engage said connecting wire against the two respective contact areas and to weld said connecting wire to said contact areas.
In thermocompression welding apparatus for successively welding connecting wires between respective pairs of contact areas of a semiconductor body and of a housing for said semiconductor body, including a welding head carrying a welding capillary from the mouth of which the said connecting wire emerges for application against one contact area of a pair of said contact areas by said welding capillary to effect a weld between said connecting wire and the contact area against which it is applied, said welding head further carrying a separate welding tool in laterally spaced relation with said welding capillary, means for orienting said welding head respective to different pairs of said contact areas to align said welding capillary and said welding tool successively with respective pairs of contact areas, means for adjustably feeding prior to each welding step a length of wire from said welding capillary so that a length of connecting wire emerges therefrom corresponding to the separation between the respective pair of contact areas between which the connecting wire is to be welded by said particular welding step, means for automatically adjusting the lateral separation of said welding capillary and said welding tool according to said adjusted connecting wire length, means for bending said length of connecting wire emergent from said capillary towards said welding head in a path of movement towards and away from said pair of contact areas to cause said welding capillary and said welding tool to apply said connecting wire lengths against a pair of contact areas and to effect respective welds therebetween and thereafter to move said welding capillary and said welding tool away from said contact areas and sever the connecting wire adjacent the mouth of said capillary.
Dependencies are inferred from the claim text.