Temperature monitoring of semiconductors
AssigneeCanadian General Electric Company Limited
InventorsDavid R. Boothman, Everett C. Elgar
Life of this patent
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Abstract
A circuit for monitoring semiconductor junction temperature includes means for obtaining a signal representing the current flowing through the semiconductor, a current controller, an electrical analog of the thermal system of the semiconductor, a direct current supply, and a voltage level detector. The current controller is connected in circuit with the analog and the combination to the d.c. supply. The current conducted by the controller via the analog is controlled by the signal such that the voltage across the analog indicates junction temperature and this voltage is monitored by means of the level detector.
Claims11
A circuit for monitoring the temperature of a junction of a semiconductor comprising:
- a. means for producing a signal having a value which is a function of the current conducted by the semiconductor;
- b. an electrical circuit analog of the thermal system of the semiconductor, said analog including electrical representations of the heat capacities of a total semiconductor structure including a heat sink and further including electrical representations of the thermal resistances from the junction to ambient;
- c. a current controller in circuit with said analog for controlling the current of said analog, said analog and said controller together comprising an analog-controller circuit;
- d. means for furnishing the current of said analog-controller circuit;
- e. means for applying said signal to said controller for controlling the conduction thereof whereby the control of said controller by said signal is such that the relation of signal value to the analog current magnitude approximates the power dissipation characteristic of the semiconductor junction;
- and,
- f. means connected to said analog for detecting a voltage thereof representative of junction temperature.
A circuit for monitoring the temperature of a junction of a semiconductor device having a junction, a wafer, a body and a heat sink comprising:
- a. means for producing a signal having a value which is a function of the current conducted by the semiconductor device;
- b. an electrical resistance-capacitance analog of the thermal system of the semiconductor device including a first capacitance means representing the heat capacity of the junction of the semiconductive device, additional capacitance means representing the heat capacities of the wafer, body and heat sink and resistance means representing the thermal resistance from the junction to ambient;
- c. a current controller having a plurality of stages, each of said stages being responsive to said signal to control the magnitude of current conducted thereby, each of said stages being connected in parallel and having one side thereof connected to one side of said first capacitance means;
- d. a d.c. current supply having one pole connected to the other side of each of said stages and a second pole connected to the other side of said first capacitance means;
- e. means to apply said signal to each of the stages of said controller whereby the currents collectively conducted by said stages approximate a curve representing the power dissipation characteristics of the junction;
- and,
- f. means connected to said first capacitance means for measuring a voltage thereof representing the temperature of said junction.
Dependencies are inferred from the claim text.