Article mounting adhesive
AssigneeWestern Electric Company, Inc.
InventorEdwin J. Pritchard
Life of this patent
Estimating the term…
Abstract
A chlorinated naphthalene and a paraterphenyl are mixed to provide an adhesive for adhering a semiconductor wafer to a support for processing. The adhesive so formed may be evaporated at the end of processing the wafer, without leaving a residue, to release the devices which have been formed from the wafer.
Claims7
An evaporable thermoplastic adhesive for mounting articles which comprises:
- a. at least one isomer of chlorinated naphthalene;
- and
- b. p-terphenyl.
An evaporable semiconductor wafer mounting adhesive which comprises:
- a. the tetra, penta, and hexa isomers of chloronaphthalene;
- and
- b. about 11.5% by weight of p-terphenyl.
A completely evaporable thermoplastic adhesive mixture which comprises, (1) a first component comprising 20, 40 and 40 percent, respectively, of tetra, penta and hexachloronaphthalenes and (2) a second component comprising p-terphenyl.
Dependencies are inferred from the claim text.