Adhesive compositions and flexible heating device fabricated therewith
AssigneeWacker Chemie AG
InventorsManfred Leiser, Karl-Heinrich Wegehaupt, Wilhelm Marsch
Life of this patent
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Abstract
The invention relates to adhesive compositions comprising vinyl containing organopolysiloxanes, organopolysiloxanes having Si-bonded hydrogen atoms and catalysts which promote the addition of the Si-bonded hydrogen atoms to the vinyl groups. These adhesives may be combined with other electrically conductive materials and used in connecting flexible heating resistors to electrodes.
Claims7
A flexible electrically conducting heating device comprising a heat resistor and a pair of electrodes in contact with and adhered to the surface of the resistor by a cured electrically conductive composition, said conductive composition is obtained from a mixture which consists essentially of (a) a vinyl containing organopolysiloxane having the formula
- R.sub.2 (CH.sub.2 =CH)SiO (R'.sub.2 SiO).sub.n Si R.sub.2 (CH=CH.sub.2)
- wherein R is selected from the group consisting of methyl and phenyl radicals, R' is selected from the group consisting of methyl, vinyl and phenyl radicals, n is a number sufficient to provide an organopolysiloxane having a viscosity of at least 100,000 cP at 25.degree. C, in which 0.1 to 1 mol percent of the diorganopolysiloxane units are vinylmethylsiloxanes and at least 90 percent of the remaining organic radicals consist of methyl radicals, and some or all of the terminal CH=CH.sub.2 groups may be R groups, (b) an organopolysiloxane containing at least three Si-bonded hydrogen atoms in which the Si-bonded hydrogen atoms are present in an amount of from 0.01 to 1.7 weight percent, (c) a catalyst which promotes the addition of Si-bonded hydrogen atoms to the vinyl groups, and (d) an electrically conductive material.
Dependencies are inferred from the claim text.