Surface acoustic wave transmission device and method of manufacturing same
AssigneeThomson-CSF
InventorGerard Coussot
Life of this patent
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Abstract
The present invention relates to the manufacture of surface acoustic wave transmission devices. The invention provides a method of cutting the edges of surface acoustic wave devices, which consists in directing on to that face designed to propagate said waves, a jet of abrasive particles.
Claims10
Surface acoustic wave transmission device comprising:
- a substrate having at least one smooth face for propagating said waves, the edge of said substrate located on the trajectory of said waves, being a ground scattering edge resulting from cutting said edge in a wafer using a jet of abrasive particles directed on to said smooth face;
- the mean profile of said ground scattering edge having a radiused form merging in said smooth face.
Method of manufacturing a surface acoustic wave device comprising a substrate having at least one smooth face designed to propagate said waves, said method comprising the steps of selecting a wafer, and of cutting, in said wafer the edges of said substrate using a jet of abrasive particles reaching said smooth face at a narrow zone of impact;
- said jet being displaced in relation to said smooth face for causing said zone of impact to follow within said smooth face, the line of cut which is to be produced;
- said cutting resulting in a radiused form of the mean profile of said edges, said radiused form merging in said smooth face, and said edges having ground zones produced by said abrasive particles.
Dependencies are inferred from the claim text.