Bonding rubber to ferrous metal through a deposit of copper and adhesive and laminate therefrom
AssigneeHonny Chemicals Company, Ltd.
InventorDennis L. Edie
Life of this patent
Estimating the term…
Abstract
The bond strength of composite articles of rubber adhered to ferrous metal substrates through an adhesive is substantially improved at ambient and elevated temperatures by depositing a loosely adhered layer of copper on said ferrous metal substrate, applying an adhesive thereover comprising an interpolymer containing about 50 to about 99% by weight of a conjugated diene, about 1-45% by weight of a heterocyclic base and 0 to about 40% by weight of at least one additional copolymerizable monomer, thereafter contacting said adhesive with the rubber to be bonded and bonding by heat and pressure.
Claims27
A laminated article comprising a ferrous metal substrate having a loosely adherent deposit of copper thereon, a layer of adhesive over said copper and rubber bonded through said copper and adhesive to said ferrous metal substrate, said adhesive consisting essentially of an interpolymer containing about 50 to about 99% by weight of a conjugated diene, about 1-45% by weight of a heterocyclic base and 0 to about 40% by weight of at least one additional monomer copolymerized therewith.
A laminated article according to claim 16 wherein, said heterocyclic nitrogen base is selected from the group consisting of 2-vinyl pyridine;
- 2-vinyl-5-ethylpyridine;
- 2-methyl-5-vinylpyridine;
- 4-vinyl pyridine;
- 2,3,4-trimethyl-5-vinylpyridine;
- 3,4,5,6 tetramethyl-2-vinylpyridine;
- 3-ethyl-5-vinylpyridine;
- 2,6-diethyl-4-vinylpyridine;
- 2-isopropyl-4-nonyl-5-vinylpyridine;
- 2-methyl-5-undecyl-3-vinylpyridine;
- 2-decyl-5-(alpha-methylvinyl)pyridine;
- 2-vinyl-3-methyl-5-ethyl-pyridine;
- 2-methoxy-4-chloro-6-vinylpyridine;
- 3-vinyl-5-ethoxypyridine;
- 2-vinyl-4,5-dibromopyridine;
- 2-vinyl-4-chloro-5-bromopyridine;
- 2(alpha-methylvinyl)-4-hydroxy-6-cyanopyridine;
- 2-vinyl-4-phenoxy-5-methylpyridine;
- 2-cyano-5-(alpha-methylvinyl)pyridine;
- 3-vinyl-5-phenyl pyridine;
- 2-(paramethylphenyl)-3-vinyl-4-methylpyridine;
- 3-vinyl-5-(hydroxyphenyl)-pyridine;
- 2-vinylquinoline;
- 2-vinyl-4-ethylquinoline;
- 3-vinyl-6,7-di-n-propyl quinoline;
- 2-methyl-4-nonyl-6-vinylquinoline;
- 4(alphamethylvinyl)-8-dodecyl quinoline;
- 3-vinylisoquinoline;
- 1,6-dimethyl-3-vinylisoquinoline;
- 2-vinyl-4-benzyl-quinoline;
- 3-vinyl-5-chloroethylquinoline;
- 3-vinyl-5,6-dichloroisoquinoline;
- 2-vinyl-6-ethoxy-7-methylquinoline and 3-vinyl-6-hydroxymethylisoquinoline.
A process for bonding rubber to a ferrous metal substrate which comprises depositing a loosely adherent layer of copper on said ferrous metal substrate, applying an adhesive thereover, said adhesive consisting essentially of an interpolymer containing about 50 to about 99% by weight of a conjugated diene, about 1-45% by weight of a heterocyclic base and 0 to about 40% by weight of at least one additional monomer copolymerized therewith, thereafter contacting said adhesive with the rubber to be bonded and bonding by heat and pressure.
Dependencies are inferred from the claim text.