Method for coating bonding tools and product
AssigneeTribotech
InventorDenis K. Gilding
Life of this patent
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Abstract
A method for the electrodeposition of osmium, ruthenium or their alloys from alkali metal salts of the same in a nonaqueous solvent capable of permitting dissociation of the salt and having low surface tension (e.g., methanol or dimethyl formamide) or mixtures. A silicone layer chemically bonded to the surface of said electrodeposited layer. Also, a bonding tool having a tip coated by either of the above electrodeposited layer or the silicone layer, or both.
Claims7
A method for bonding a silicone layer to the surface of a microstructural bonding tool for holding a bonding wire against a surface to which the wire is to be bonded during application of energy thereto, which tool comprises an elongate tool body having a wire guide opening and a bonding surface at the end thereof, the method comprising treating the surface of the hard metal substrate to form pendant groups of the general formula, --OM wherein M is hydrogen or a cation having a valence of one, and contacting the treated surface with a silane of the general formula (R).sub.n Si(X).sub.4-n wherein n varies from 0 to 3, R is an aliphatic or aromatic group and X is a halogen group or alkoxy radical.
In a microstructural bonding tool for holding a bonding wire against a surface to which the wire is to be bonded during application of energy thereto, said tool including an elongate tool body having wire guide means and a metal bonding surface at the end thereof, the improvement comprising a silicone layer bonded to said metal bonding surface through metal-oxygen-silicon bonds, said silicone layer being characterized by gall resistance and electrical insulation.
Dependencies are inferred from the claim text.