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US 4,049,416 AGranted
Method of joining a metal part having a copper surface and a glass part
AssigneeU.S. Philips Corporation
InventorHerman Bloem
Life of this patent
Estimating the term…
Abstract
Bonding a metal part having a copper surface to glass, in particular a semiconductor device. A small quantity of Cr.sub.2 O.sub.3 or CuO is added to the glass. The copper is oxidized at a relatively low temperature and relatively low oxygen pressure and thereafter sealing-in is performed in a nonoxidizing atmosphere.
Claims4
A method for joining a metal part, of which at least the surface consists of copper, to a glass having a coefficient of expansion suitable for joining to the metal part which comprises the sequential steps of:
- providing a basic mixture of glass which includes at least one material selected from the group consisting of chromium and copper compounds, the total quantity of materials from said group being between 0.2 and 5% by weight calculated as Cr.sub.2 O.sub.3 and CuO respectively;
- providing a copper exterior surface;
- holding the copper exterior surface in abutting relationship to said basic mixture of glass;
- oxidizing the copper exterior surface abutting said mixture of glass in an oxidizing atmosphere at substantially the lowest possible temperature for said oxidizing atmosphere and then heating both said mixture of glass and said exterior surface in a non-oxidizing atmosphere.
1 more element
Dependencies are inferred from the claim text.