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US 4,049,185 AGranted
Method of forming double extruded mount
AssigneeThe Nippert Company
InventorRussell A. Nippert
Life of this patent
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Abstract
A process for the formation of a mount for a semi-conductor, such as a rectifier or the like, in which a steel ring and a steel tube are brazed in position on the upper surface of a previously formed hexagonal copper billet, following which the parts are cold-formed in a plurality of extrusion steps for producing an accurately formed mount in which the copper material is work-hardened.
Claims3
The method of forming a mount for a solid state rectifier and the like which comprises
- a. forming a hexagonal shaped billet of high conductivity copper,
- b. brazing a steel ring on the upper surface of said billet,
- c. brazing a steel tube in position within said ring on the upper surface of said billet,
- d. cold-forming said billet in a first extrusion step to provide a recess in the upper face of said billet of the same diameter as the inner diameter of said tube and concurrently generating a weld-projection on the upper surface of said ring,
- e. and additionally cold-forming said billet in a second extrusion step to form a downwardly projecting stem thereon (and to additionally shape said weld projection), said first and second extrusion steps causing work-hardening of said brazed joints and of the copper of said billet.
2 more elements
Dependencies are inferred from the claim text.