Selective plating apparatus

Apparatus for continuous electroplating of at least first and second mutually insulated selected portions of an electronic component or the like, while effecting differential plating thicknesses upon said portions, said apparatus comprising:

• an electroplating station;
• moveable applicator means adapted for carrying electroplating solution on a surface thereof;
• means for continuously moving at least a portion of said applicator means surface through said electroplating station;
• means for applying electroplating solution to said applicator surface;
• means for moving said components through said electroplating station with said portions to be electroplated in contact with said applicator surface;
• a source of electrical plating potential;
• means connecting the negative side of said potential source to each of said mutually insulated portions of said components during movement of said components through said electroplating station;
• anodic means underlying said applicator surface at said electroplating station, and connected in a circuit with the positive side of said potential source in order to effect a plating current;
• a shunt path means connected between one of said component portions and the positive side of said potential source, for shunting at least a portion of the current to said one portion, back to said potential source, whereby to effect differential plating between said first and second portions of said component in accordance with the current proportioning effected by said shunt path;
• the components to be plated in said apparatus being of the type comprising an electrically conductive body terminating in a die-receiving face, and including a plurality of electrical contacts formed as insulated islands at said die-receiving face, with flexible wire leads being connected to at least some of said contacts and extending oppositely from said die-receiving face beyond the body of said component, at least some of said leads being electrically insulated from said body;
• said selective portions to be electroplated being said die-receiving face, and said electrical contacts;
• and wherein said apparatus includes electrically conductive guide means for guiding said components through said electroplating station with the said component body in electrical contact with said guide, and with said die-receiving face and said contacts in contact with the said applicator surface;
• the said means connecting the negative side of said potential source to at least said leads comprising an electrically conductive brush mounted at said electroplating station;
• and said shunt path being provided by a connection between said guide means and the positive side of said potential source.