Processing copper base alloys

A process for obtaining an improved combination of strength and bend properties in copper base alloys having low stacking fault energy which comprises:

• A. providing a copper base alloy having a stacking fault energy of less than 30 ergs per square centimeter consisting essentially of a first element selected from the group consisting of about 2 to 12% aluminum, about 2 to 6% germanium, about 2 to 10% gallium, about 3 to 12% indium, about 1 to 5% silicon, about 4 to 12% tin, about 8 to 37% zinc, and the balance essentially copper wherein said alloy is fully recrystallized and has a fine grain size of less than 0.015 mm;
• B. cold working said alloy at least 60%;
• C. annealing said alloy at a metal temperature of from 280.degree. to 425.degree. C to obtain a non-random texture with a plastic strain ratio measured 90.degree. to the rolling direction of less than about 0.75;
• wherein the grain structure after said annealing is either unrecrystallized or partially recrystallized;
• and
• D. finally cold working said material less than 40%.