Electrostatically bonded dielectric-on-semiconductor device, and a method of making the same

An amplifying surface wave transducer comprising:

• A. a piezoelectric body of bulk material, having opposed first and second major surfaces with at least said first major surface or planar configuration, and having piezoelectric properties;
• B. a semiconductor body of a bulk material of substantially uniform thickness between about 1 and 50 microns and given conductivity type and having opposed first and second major surfaces with at least said first major surface of planar configuration, said first major surface being electrostatically bonded to said first major surface of said piezoelectric body;
• C. at least first and second electrodes spaced apart from each other on said first major surface of said piezoelectric body with the semiconductor body electrostatically bonded to said first major surface therebetween, said first being a grid with interdigitated fingers adapted to receive an electrical signal and generate acoustic surface waves along said major surface of the piezoelectric body responsive to said electrical signal, and said second electrode being a grid of interdigitated fingers adapted to receive an acoustic surface wave transmitted along said major surface of the piezoelectric body from said first electrode and produce an electrical output signal responsive to said acoustic surface wave;
• and
• D. two field electrodes positioned on said second major surface of said semiconductor body substantially parallel to each other along and astride the direction of travel of surface waves between said first and second electrodes to form an amplifying acoustic surface wave transducer.

An amplifying surface wave transducer comprising:

• A. a piezoelectric body of a bulk material of a substantailly uniform thickness between about 1 and 5 microns, having opposed first and second major surfaces with at least said first major surface of planar configuration, and having piezoelectric properties;
• B. a semiconductor body of a bulk material and given conductivity type and having opposed first and second major surfaces with at least said first major surface of planar configuration, said first major surface being electrostatically bonded to said first major surface of said piezoelectric body;
• C. at least first and second electrodes spaced apart from each other on said second major surface of the piezoelectric body, with said semiconductor body electrostatically bonded to said opposed first major surface of said piezoelectric body, said first electrode being a grid with interdigitated fingers adapted to receive an electrical signal and generate acoustic surface waves along said major surface of the piezoelectric body responsive to said electrical signal, and said second electrode being a grid with interdigitated fingers adapted to receive an acoustic surface wave transmitted along said major surface of the piezoelectric body from said first electrode and produce an electrical output signal responsive to said acoustic surface wave;
• and
• D. the resistivity of said semiconductor body at least in portions adjoining said first major surface opposite said first and second electrode positioned on said second major surface of the piezoelectric body being less than 1.0 ohm-cm to provide at least a plane of conductivity in the semiconductor body adjacent said first major surface opposite said electrodes.

An acoustic surface wave convolver:

• A. a piezoelectric body of a bulk material, having opposed first and second major surfaces with at least said first major surface of planar configuration, and having piezoelectric properties;
• B. a semiconductor body of a bulk material of substantially uniform thickness between about 1 and 50 microns, and given conductivity type and having opposed first and second major surfaces with at least said first major surface of planar configuration, said first major surface being electrostatically bonded to said first major surface of said piezoelectric body;
• C. at least first and second electrodes spaced apart from each other on said first major surface of the piezoelectric body with the semiconductor body electrostatically bonded to said first major surface therebetween, said first electrode being a grid with interdigitated fingers adapted to receive an electrical signal and generate acoustic surface waves along said major surface of the piezoelectric body responsive to said electrical signal, and said second electrode being a grid if interdigitated fingers adapted to receive an acoustic surface wave transmitted along said major surface of the piezoelectric body from said first electrode and produce an electrical output signal responsive to said acoustic surface wave;
• D. an output electrode on said second major surface of said semiconductor body between said first and second electrode astride the direction of travel of surface waves between said first and second electrodes to form an acoustic surface wave convolver.