Metallic bonding method
AssigneeAssociated Engineering Limited
InventorsDennis Cockburn Brown, Reginald Murray
Life of this patent
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Abstract
Bonded metallic structures comprising at least two pieces each of a metallic aluminous substance selected from the group consisting of aluminium and aluminium alloys are formed by bonding the pieces together by eutectic diffusion bonding using a metallic interlayer material which is applied between the surfaces to be joined, which forms a less stable oxide than that formed by the aluminous substance and which is preferably selected from the group consisting of copper and copper-rich alloys including at least about 95% copper.
Claims22
A method of bonding together at least two pieces of aluminium alloy by eutectic diffusion bonding using, between the surfaces to be joined, an interlayer selected from the group consisting of copper and copper-rich alloys including at least about 95% copper and in which said pieces are heated and said surfaces to be joined are pressed together to form a metallurgical bond therebetween, characterized in that at least one of said pieces is of high silicon aluminum alloy and at least one other of said pieces is of an aluminium alloy having a melting point not lower than that of said high silicon aluminum alloy and in that said one piece of high silicon aluminum alloy and said other piece of aluminium alloy are heated to a temperature in the range of about 515.degree. to about 530.degree. C, whereby to form between the joined surfaces a metallurgical bond consisting of a complex alloy of at least said high silicon aluminum alloy and said interlayer.
A bonded structure comprising at least two pieces of aluminium alloy having between their joined surfaces a metallurgical bond formed by eutectic diffusion bonding using between the surfaces to be joined an interlayer selected from the group consisting of copper and copper rich alloys including at least about 95% copper, characterized in that at least one of said pieces is of high silicon aluminum alloy and at least one other of said pieces is of an aluminium alloy having a melting point not lower than that of said high silicon aluminum alloy and in that said metallurgical bond is formed of a complex alloy consisting at least of said high silicon aluminum alloy and said interlayer.
Dependencies are inferred from the claim text.