Method of producing metallic carrier system for a multi-electrode semiconductor strip

A method for producing a metallic carrier system for a multi-electrode semi-conductor chip comprising the steps of:

• a. providing a base carrier sheet of a first metal that can readily be soldered;
• b. etching recesses in the carrier sheet in portions of the carrier sheet to be covered by inner feed lines;
• c. applying covering masks to opposite sides of the sheet by photolithographic process with open portions in the mask on one side of the carrier sheet conforming to the inner feed lines;
• d. producing inner feed lines with recessed expansible portions by the galvanic deposition of at least a second metal in the open portions of the mask, and into said recesses, said second metal being of a type capable of being readily connected to a semi-conductor body;
• e. covering the feed lines with protective layers;
• and
• f. then etching the outer carrier legs from the opposite side of the sheet in accordance with the pattern of the covering mask applied thereto by selective etching;
• the recessed expansible portions of the feed lines compensating for the difference in expansion between the connection legs of the carrier sheet, the inner feed lines and the semi-conductor chip.