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US 4,045,303 AGranted
Process of electroplating porous substrates
AssigneeBillings Energy Corporation
InventorBarrie C. Campbell
Life of this patent
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Abstract
A method of electroplating porous substrates includes the steps of disposing a porous substrate to be electroplated in an electrolyte solution, disposing an anode in the solution spaced apart from the substrate, with the anode being composed of the material to be deposited on the substrate, applying a gas to the substrate to flow therethrough, and applying a positive voltage to the anode and a negative voltage to the substrate while gas is flowing through the substrate.
Claims11
A method of electroplating porous substrates comprising
- placing a porous substrate in an electrolyte solution which includes ions of the material to be deposited on the substrate,
- forcing a gas through the porous substrate from the bottom side upwardly, and
- applying an electric current to the substrate and electrode while gas is being forced through the substrate.
A method of electroplating porous substrates comprising
- disposing a porous substrate to be electroplated in an electrolyte solution which comprises ions of the material to be deposited onto the substrate,
- disposing an anode in the solution spaced from the substrate,
- applying a gas to the substrate to flow therethrough, and
- applying a positive voltage to said anode and a negative voltage to said substrate while gas is being applied to said substrate.
1 more element
Dependencies are inferred from the claim text.