Making Schottky barrier devices
AssigneeU.S. Philips Corporation
InventorsJohn Martin Shannon, Julian Robert Anthony Beale
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AssigneeU.S. Philips Corporation
InventorsJohn Martin Shannon, Julian Robert Anthony Beale
Estimating the term…
A semiconductor device comprising a semiconductor body portion having a shallow surface layer which is higher doped than the bulk of the semiconductor body portion, and a metal electrode on this layer and forming a Schottky barrier with the body portion. The layer serves to control the effective height of the barrier. The depth of the layer is such that the layer is substantially depleted of charge carriers in the zero bias condition whereby the slope of the reverse current-voltage characteristic of the barrier below break-down is determined by the doping of the bulk of the body portion substantially independently of the presence of the layer. Depending on the conductivity type of the layer relative to the bulk, the barrier can be higher or lower than that which would be formed in the absence of this layer. By providing the layer by implantation good control of the doping and hence of the barrier height can be obtained. Applicable to both discrete Schottky diodes and Schottky barriers in integrated circuits.
A method of manufacturing a semiconductor device having a Schottky barrier of desired barrier height between a metal and a semiconductor body portion but without significant degrading of its reverse characteristics, comprising providing a semiconductor body portion of given doping level which if directly contacted with a metal capable of forming therewith a Schottky barrier would result in a barrier of given height different from the desired barrier height, subjecting the said body portion to dopant ion bombardment to implant dopant therein to form a shallow surface layer having a higher doping level than said given doping level, the implanted ion dose being such as to change the given barrier height to that desired when contacted by said metal, the bombarding ion energy being such as to restrict the depth of the implanted layer from the surface to such a small value that it remains below the thickness of the depletion layer extending from the Schottky barrier in the zero bias condition of the barrier, whereby the implanted layer remains substantially depleted of charge carriers and the reverse characteristics of the barrier will not be significantly degraded, applying said metal as a contact to said body portion such that the barrier is formed between said metal and said shallow surface layer, and making an electrical connection to the body portion.
Dependencies are inferred from the claim text.