Method of forming glass substrates with pre-attached sealing media
AssigneeOwens-Illinois, Inc.
InventorCharles W. Salisbury
Life of this patent
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Abstract
Glass substrates having electrical conductors deposited thereon used in gas panel fabrication with vitreous or crystalline solder glass attached thereto are disclosed as well as a method of applying and attaching said solder glass to such substrates.
Claims3
A method of producing a glass substrate with electrical conductors deposited thereon suitable for gas panel fabrication which comprises drawing a vitreous or crystallizing solder glass consisting essentially of, on a weight basis, 72% PbO, 15% B.sub.2 O.sub.3, 4% SiO.sub.2, 5% Al.sub.2 O.sub.3 and 4% ZnO and having a softening point of 811.degree. F into at least one rod 3 - 40 mils in diameter, applying said rod to one surface of said substrate adjacent the periphery thereof, and pre-firing said substrate for a period of time and at a temperature sufficient to permanently attach the solder glass thereto in a highly sintered or glassy state which will reflow and seal at a predetermined sealing temperature.
A method of producing a glass substrate with electrical conductors deposited thereon suitable for gas panel fabrication which comprises drawing a vitreous or crystallizing solder glass consisting essentially of, on a weight basis, 72% PbO, 15% B.sub.2 O.sub.3, 2% SiO.sub.2, 5% Al.sub.2 O.sub.3, and 6% ZnO and having a softening point of 800 .degree. F into at least one rod 3 - 40 mils in diameter, applying said rod to one surface of said substrate adjacent the periphery thereof, and pre-firing said substrate for a period of time and at a temperature sufficient to permanently attach the solder glass thereto in a highly sintered or glassy state which will reflow and seal at a predetermined sealing temperature.
A method of producing a glass substrate with electrical conductors deposited thereon suitable for gas panel fabrication which comprises drawing a vitreous or crystallizing solder glass consisting essentially of, on a weight basis, 71% PbO, 19% B.sub.2 O.sub.3, 2% SiO.sub.2, 15.9% ZnO, and 1.1% SnO.sub.2 and having a softening point of 400.degree. F into at least one rod 3 - 40 mils in diameter, applying said rod to one surface of said substrate adjacent the periphery thereof, and pre-firing said substrate for a period of time and at a temperature sufficient to permanently attach the solder glass thereto in a highly sintered or glassy state which will reflow and seal at a predetermined sealing temperature.
Dependencies are inferred from the claim text.