Multiple ball element wafer breaking apparatus

Abstract

An apparatus is disclosed for breaking apart, pre-scribed chips in a semiconductor wafer. The apparatus comprises a plurality of ball elements having a diameter substantially smaller than the diameter of the wafer, mounted in a support beneath the contacting plane. Located above and in spaced coaxial relationship with the ball elements is a plurality of purging gas/vacuum ports. The pre-scribed semiconductor wafer is mounted on an elastic film by means of an adhesive coating thereon. The wafer, so mounted, is attached to a sliding carriage disposed so as to permit the wafer to freely move within said contacting plane. When the wafer is disposed in said contacting plane, the support for said ball element is raised into contact with the wafer. The relatively small radius of curvature of the ball elements induces a relatively large bending moment and consequently breaks the chip in the wafer along the pre-scribed lines. Omni-directional motion of the carriage causes all portions of the wafer to be brought in to contact with the ball elements, thereby inducing total separation along all pre-scribed lines. The purging gas/vacuum ports located respectively above each ball element, serve to remove debris from the broken regions of the wafer.

Dependencies are inferred from the claim text.