Printed circuit base board and method for manufacturing same
AssigneesSumitomo Bakelite Co., Ltd., Nomura Electroplating Company, Ltd.
InventorHirotoshi Nomura
Life of this patent
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Abstract
A base board for printed circuits prepared by the additive process, obtained by heating under pressure a layer comprising at least one sheet of prepreg comprising a thermosetting resin as impregnant and a layer of composition comprising a semi-cured thermosetting resin and a nitrile rubber, said layer of composition being placed on one or both sides of said prepreg layer to integrate said layers as a finished laminate. This base board is used in the additive process for manufacturing a printed circuit board having favorable properties with strong adhesion between the circuit and the base board without showing any warp or twist.
Claims23
A base board, for printed circuits for preparation by the additive process, obtained by heating under pressure (1) a layer of prepreg comprising a thermosetting resin as impregnant, (2) adjacent to said prepreg layer one or two layers of a semi-cured composition comprising 50-300 parts by weight of a thermosetting resin and 100 parts by weight of a nitrile rubber, and (3) adjacent to said composition layer one or two layers of phospholipid, said one or two layers of composition being placed on one or both sides of the layer of prepreg, said one or two layers of phospholiped being applied to the outer side of said layer of composition, to integrate the layers as a finished laminate.
A base board for printed circuits according to claim 2, wherein the resin of the prepreg layer is a resin selected from the group consisting of a phenol resin, a polyimide resin, and a hardener-containing epoxy resin, and the resin of the layer of the composition is a mixed resin of a phenol resin and an epoxy resin.
A method for manufacturing a base board, for printed circuits for preparation by the additive process, characterized by heating under pressure a layer of prepreg comprising a thermosetting resin as impregnant, and one or two second layers of a transfer sheet material coated with a semi-cured composition of 50-300 parts by weight thermosetting resin and 100 parts by weight nitrile rubber, after undercoating a phospholipid on the transfer sheet material, said one or two layers of composition and phospholipid coated transfer sheet material being placed on one or both sides of the layer of prepreg so as to make contact between the coated side of the sheet material and the prepreg, to integrate the layer of prepreg and the coated sheet material as a finished laminate, and thereafter removing said sheet material, so that a coated composition of sheet material is transferred on the layer of prepreg.
A method of manufacturing a base board for the preparation of printed circuits by the additive process comprising:
- providing a pair of caul plates each coated with a phospholipid;
- and
- heating under pressure between said coated caul plates:
- 1. a layer of a first prepreg comprising a thermosetting resin as impregnant, said layer becoming the core layer of the finished base board, and
- 2. adjacent to the prepreg layer one or two sheets of coated second prepreg comprising a semi-cured thermosetting resin and a nitrile rubber composition, in the amount of 50 to 300 parts by weight of said resin to 100 parts by weight of said nitrile rubber, coated on one or both sides of said second prepreg, said second prepreg comprising a thermosetting resin as impregnant, said coated second prepreg lying adjacent said coated caul plate,
- said one or two sheets of coated second prepreg thereby becoming the surface layer of the base board with the coated side outward on one or both sides of said core layer.
Dependencies are inferred from the claim text.