Adjustable crimp die assembly

In a crimp die assembly adapted to be mounted in a press for crimping terminals formed on a carrier strip and spaced a given distance from one another onto stripped insulated wire leads, said crimp die including a base with a terminal supporting structure for supporting the strip of terminals, said supporting structure having a crimp station whereat a terminal is crimped onto a wire lead, a punch assembly opposite said crimp station and operably connected to said press for reciprocal movement toward and away from said crimp station so that a portion thereof engages a wire lead and terminal at the crimp station, and a terminal feed assembly associated between said punch assembly and said terminals for feeding the strip of terminals one at a time to the crimp station in response to the movement of the punch assembly, the improvement in said terminal feed assembly comprising:

• pawl means movable in a sequence from a first position above said terminal strip to a second position engaging said strip away from the crimp area to a third position closer to said crimp area moving said strip therewith, and back to said first position, the distance between said second and third positions being equal to the progression distance between adjacent terminals on the strip so that successive terminals are presented to the crimp area;
• and
• an adjustable cam assembly operably associated between said punch assembly and said pawl means for moving said pawl means in response to the movement of the punch assembly, said cam assembly including a first cam member associated with said pawl means and a second cam member associated with said punch assembly, said first and second cam members being adjustably secured to one another for changing the relative configuration thereof which changes the distance of the pawl means movement between its second and third positions to accomodate different terminal strips.