Bonding of organic thermoplastic materials
AssigneeP. R. Mallory & Co. Inc.
InventorsPaul T. Woodberry, Donald G. Wilson
Life of this patent
Estimating the term…
Abstract
An organic thermoplastic resin having dielectric properties is bonded to a substrate material by heating the plastic, bringing it into contact with the substrate, and applying an electric potential therethrough so as to join the plastic and the substrate together. The substrate material may be an electrical conductor such as a metal sheet or foil, or it may be a plastic of similar or dissimilar chemical composition or a glass or other dielectric.
Claims21
A method of bonding an organic thermoplastic dielectric material to a substrate, comprising the steps of juxtapositioning surfaces to be bonded of said material and said substrate, applying sufficient heat to said material to cause softening thereof, employing a source of electric potential to established a region of electric potential between two electrodes wherein said region of electric potential further comprises an electric field, applying said region of electric potential to said juxtaposed surfaces for a time sufficient to draw said surfaces together to form a bond therebetween, and cooling said bonded surfaces with said region of electric potential removed.
A method of bonding an organic thermoplastic dielectric material to a substrate comprising the steps of juxtapositioning surfaces to be bonded of said material and said substrate, applying sufficient heat to said material to cause softening thereof, employing a source of electric potential to create an electric potential of one polarity at said substrate and an electric potential of an opposite polarity at said material to establish a region of electric potential between the juxtaposed surfaces of said material and said substrate wherein said region further comprises an electric field, applying said region of electric potential to said juxtaposed surfaces for a time sufficient to deform said softened material to substantially conform to the surface irregularties of said substrate to form a bond therebetween, and cooling said bonded surfaces with said region of electric potential removed.
Dependencies are inferred from the claim text.